Advanced Thermal Materials

Jiangsu Jingkun Technology Co., Ltd. specializes in advanced thermal management materials for next-generation electronic packaging. We combine in-house research, manufacturing and technical support across key material systems including aluminum-diamond, copper-diamond, aluminum-graphite and aluminum silicon carbide.

Our portfolio includes diamond-copper, diamond-aluminum, aluminum silicon carbide, aluminum-silicon alloys and gradient composites designed for high-performance heat dissipation. These materials serve demanding defense, semiconductor and automotive applications where thermal stability, reliability and weight reduction are critical.