Excellent Performance
Diamond metal thermal materials are developed for electronic packaging applications that need both high heat dissipation and low thermal expansion. With thermal conductivity of up to 2200 W/(m·K), diamond is far more conductive than conventional filler materials, while the metal matrix keeps the composite practical for manufacturing and integration.
Jingkun's diamond-copper and diamond-aluminum materials combine high thermal conductivity, low CTE, low density and metallizable surfaces. They are suitable for high-power packaging applications where lower junction temperature and better thermal stability help improve device performance and reliability.
| Parameter | Value |
|---|---|
| Material Density | 3.2-3.3g/cm³ |
| Thermal Conductivity | 850-1000W/m·K (25℃) |
| CTE | 5.0-6.0×10-6K-1 (25-150℃) |
| Flexural Strength | ≥350Mpa |
These materials are designed for applications that require high thermal conductivity, low expansion and reduced weight. Typical uses include electronics and communications, aerospace, smart grids, rail transit, new energy vehicles, RF devices, high-power lasers, AI chips and power modules.
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